Difference between revisions of "Magnetron Sputtering Coater"
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Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode. | Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode. | ||
<swf width="500" height="400"> | <swf width="500" height="400">images/5/5f/Sputtering.swf</swf> | ||
=== Operation === | === Operation === | ||
Revision as of 09:28, 11 October 2010
Background
Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.
<swf width="500" height="400">images/5/5f/Sputtering.swf</swf>