Difference between revisions of "Magnetron Sputtering Coater"
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=== Background === | === Background === | ||
Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode. | Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode. | ||
=== Operation === | === Operation === | ||
Revision as of 14:28, 9 September 2010
Background
Magnetron sputtering deposition is a fast technique for applying a thin layer of inorganic materials on a substrate, such as ITO or metallic contacts. The magnetron ionizes argon gas which then accelerates towards the cathode where the target materials is located. The stream of argon ions erodes away the target material making a charged cloud which then deposits on the substrate located at the anode.